Semron Secures $7.9M to Build Ultra-Low-Power AI Chips with 3D Packaging

by curvature
Semron Secures $7.9M to Build Ultra-Low-Power AI Chips with 3D Packaging

How Semron’s CapRAM Technology Can Enable Ultra-Low-Power AI Chips for Mobile Devices?

Semron, a German startup that specializes in developing energy-efficient AI chips with 3D packaging, has raised $7.9 million (7.3 million euros) in a seed funding round led by Join Capital and supported by SquareOne, OTB Ventures, and Onsight Ventures.

Semron’s vision is to set a new standard for AI chips in mobile devices, such as smartphones, earbuds, and VR headsets, by using a novel semiconductor device architecture based on a variable capacitor (memcapacitor). Unlike traditional approaches that rely on currents and transistors, Semron’s technology, called CapRAM, significantly reduces electron movement and heat dissipation, resulting in a 20-fold increase in energy efficiency at the chip level.

Also Read: ElevenLabs: The Voice Cloning AI Startup that Became a Unicorn in Two Years

Moreover, Semron’s technology allows for stacking several layers of chips on top of each other, enabling truly three-dimensional chip architectures that can support AI models up to 1,000 times larger than current capacities, while maintaining the same chip size. This means that Semron’s chips can perform complex and sophisticated AI tasks, such as natural language processing, computer vision, and speech recognition, on mobile devices, without compromising on speed, quality, or battery life.

Semron’s co-founders, Aron Kirschen and Kai-Uwe Demasius, have been working on the idea of CapRAM since their university days, and have spent years researching and developing the technology. They founded Semron in February 2020, and have since built a team of experts in semiconductor technology, AI, and machine learning. They have also secured partnerships with leading semiconductor manufacturers and research institutes, such as GlobalFoundries and Fraunhofer IPMS.

The seed funding round will help Semron scale up its operations and offerings, and deliver its first products to the market. Semron plans to launch its first AI chip, called Semron 1, in the second half of 2022, and to target applications in the consumer electronics, healthcare, and automotive sectors. Semron also aims to expand its team, attract more customers and partners, and continue to innovate and improve its technology.

Also Read: Anomalo Raises $33M to Expand its Machine Learning Solution for Data Quality

Semron’s investors are impressed by the team’s vision, expertise, and achievements, and believe that Semron has the potential to disrupt the AI chip industry and create a positive impact on society. They also see Semron as a strategic partner that can help them access and leverage the latest innovations and opportunities in the AI and semiconductor domains.

Semron is a promising and ambitious startup that is rethinking chip design from first principles and creating the world’s most energy-efficient AI chips with 3D packaging. Semron’s technology can enable new and better experiences and applications for mobile devices, and make AI more accessible and useful for everyone. Semron is a leader and pioneer in the AI chip field, and is poised to shape the future of AI.

Also Read: Meta Unveils Code Llama 70B, a Free and Powerful AI Model for Coding News sub-headline

Related Posts

Leave a Comment